SOP

Description

SOP-integrated-circuit-chip-IC

SOP, the full name is  small outline package. The pins are drawn in an L shape from both sides of the body, the materials include plastic and ceramic. In addition to being used for memory LSI, SOP is also widely used in circuits such as ASSP that is not too large. The pin pitch is 1.27mm and the number of pins is from 8 to 44.

SOP derives some more IC packaging types, as follows:

SOJ (Small Out-Line J-Leaded Package): J-lead small outline package

TSOP (Thin Small Outline Package): This IC packaging is thinner than SOP with a pin pitch of 1.27mm

SSOP (Shrink Small Outline Package): Pin pitch is 0.635mm

TSSOP (Thin Shrink Small Outline Package): This IC package type is thinner than SOP with a pitch of 0.65mm

QSOP (Quarter-size Small Outline Package): Pin pitch is 0.635 mm

VSOP (Very Small Outline Package): It is smaller than QSOP and has a pitch of 0.4, 0.5 or 0.65 mm